Circuit Environment

A tantárgy neve magyarul / Name of the subject in Hungarian: Áramköri környezet kialakítása

Last updated: 2023. január 31.

Budapest University of Technology and Economics
Faculty of Electrical Engineering and Informatics

Branch of Electrical Engineering MSc
Smart System Integration minor specialization

Course ID Semester Assessment Credit Tantárgyfélév
VIEEMA06 2 2/1/0/v 4  
3. Course coordinator and department Dr. Takács Gábor,
4. Instructors



Department, Institute:

Dr. Takács Gábor

Assistant Professor

Department of Electron Devices

5. Required knowledge Electronics
6. Pre-requisites
TárgyEredmény( "BMEVIEEMA04" , "jegy" , _ ) >= 2

ÉS NEM ( TárgyEredmény( "BMEVIEEM359" , "jegy" , _ ) >= 2
TárgyEredmény("BMEVIEEM359", "FELVETEL", AktualisFelev()) > 0)

A fenti forma a Neptun sajátja, ezen technikai okokból nem változtattunk.

A kötelező előtanulmányi rend az adott szak honlapján és képzési programjában található.


Successfully fulfill the requirements and get the credit of the followings courses is mandatory:


Fundamentals of Smart Systems

7. Objectives, learning outcomes and obtained knowledge The scope of the subject is to get the students acquainted with the development of the packaged intelligent devices operating environment, the design software, the modern simulation tools. Deals with the design, testing, simulation steps and gives practical knowledge on their industrial applications. Introduce the theoretical background of the simulations and physical phenomenon.
8. Synopsis
Syllabus of the lectures
1. The phenomena of circuit environment, borders of the circuit environment, the design steps and implementation issues of SiP, SoP, MCM, 3D stacked ICs devices, TSV.
2. Modern packaging solutions. Fann-ot, WLP, intermediate enclosures with buried silicon layers (EMIBB). Relationship of IC design and enclosure from the design perspective.
3. Investigation of parasitic effects of packaging on the basis of Radio Frequency, thermal and other physical influences: IBIS model, Delphi model, 2R model
4. Development of circuit environment influenced by thermal effects. Active and passive cooling methods, build-up and characterization of microscale cooling devices.
5. Thermal analysis of equipments working in harsh environment (rack drawers, IoT devices in harsh environment, etc.)
6. Thermal transient testing methodology, multi-domain characterization of LED devices, characterization of thermal interface materials (TIM)
7. Introduction of a whole process development flow: the basic steps of the development, test methods, management issues. Reliability investigations, the effects of the ambient to the operation of the circuit.
8. Design flow of electrical equipment from the specification to the realization. Top-down and bottom-up methodology applied in the development flow of the circuit environment (PCW, connections, enclosures, etc.)
9. Specification and documentation issues of the circuit environment.
10. Introduction to signal integrity: plane capacitance, losses, delays, skin effect and proximity effect, wave impedance and passive devices in real parasitic elements.
11. Reflections, terminations of transmission lines: under and overdriven lines, series and parallel R, RC terminations, Thevenin termination, junction
12. Case study: pre-layout signal integrity simulation
13. Cross-talk, differential and common mode signals and impedances, signal propagation
14. Thermal management with industrial CAD tools (Mentor Graphics© FloTHERM)

Syllabus of the laboratory practises:
1. Getting acquainted to a PCW design environment and its build-up
2. Schematic capture
3. The usage and the settings of constraint editor system
4. Design of the layout
5. Thermal simulation
6. pre- and post-layout signal integrity simulations
7. Thermal analysis of packages (Mentor Graphics© FloTHERM® PACK).

9. Method of instruction 2 hours/week lectures and 1 hour/week (computer) laboratory practices including demonstration with practical examples and case studies.
10. Assessment

a.         During the term: one mid-term test in the 8th week of the semester

Requirement for granting the signature: >= 2 (satisfactory).

The signature is valid for the next semester, too.

b.         In the exam period:

Way of examination: written and oral

c.         Exam before the examination period:

Possible if the midterm grade >= 4

11. Recaps

One mid-term test.

If a student fails to turn up at mid-term test, it can be repeated during the term.

Only one laboratory practice can be repeated during the repeat period.

12. Consultations By appointment with the instructors.
13. References, textbooks and resources -        Clyde F. Coombs: „Printed Circuits Handbook, 6th edition”, McGraw-Hill, USA, 2008
-        Eric Bogatin: „Signal Integrity – Simplified”, Prentice Hall, USA, 2004
-        Stephen H. Hall, Garrett W. Hall, James A. McCall: „High- Speed Digital System – A Handbook of Interconnect Theory and Design Practice”, John Wiley & Sons, Inc. USA, 2000
-        Horward Johnson, Martin Graham: „High-Speed Digital Design – A Handbook of Black Magic, Prentice Hall”, New Jersey, USA, 1993
-        Mentor Graphics - Printed Circuit Board Design Course Laboratory Instruction:  „Pre-Layout Analysis with HyperLynx”, Politechnika ¦l±ska w Gliwicach, Instytut Elektroniki, Zakład Podstaw Elektroniki
-        Mentor Graphics – HyperLynx Design kits

14. Required learning hours and assignment



Preparation for lectures


Preparation for practices


Preparation for laboratories


Preparation for midterms




Literature review


Preparation for exam




15. Syllabus prepared by



Department, Institute:

Dr. György Bognár

Associate Professor

Department of Electron Devices

Dr. Péter Gábor Szabó

Assistant Professor

Department of Electron Devices

Zoltán Szűcs


Department of Electron Devices

Ericsson Hungary Ltd.

Dr. Ferenc Farkas

h.c. Associate Professor

Signal integrity engineer, project manager


Department of Electron Devices,

Ericsson Hungary Ltd.