Budapest University of Technology and Economics, Faculty of Electrical Engineering and Informatics

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    Circuit Environment

    A tantárgy neve magyarul / Name of the subject in Hungarian: Áramköri környezet kialakítása

    Last updated: 2023. január 31.

    Budapest University of Technology and Economics
    Faculty of Electrical Engineering and Informatics

    Branch of Electrical Engineering MSc
    Smart System Integration minor specialization

    Course ID Semester Assessment Credit Tantárgyfélév
    VIEEMA06 2 2/1/0/v 4  
    3. Course coordinator and department Dr. Takács Gábor,
    4. Instructors



    Department, Institute:

    Dr. Takács Gábor

    Assistant Professor

    Department of Electron Devices

    5. Required knowledge Electronics
    6. Pre-requisites
    TárgyEredmény( "BMEVIEEMA04" , "jegy" , _ ) >= 2

    ÉS NEM ( TárgyEredmény( "BMEVIEEM359" , "jegy" , _ ) >= 2
    TárgyEredmény("BMEVIEEM359", "FELVETEL", AktualisFelev()) > 0)

    A fenti forma a Neptun sajátja, ezen technikai okokból nem változtattunk.

    A kötelező előtanulmányi rend az adott szak honlapján és képzési programjában található.


    Successfully fulfill the requirements and get the credit of the followings courses is mandatory:


    Fundamentals of Smart Systems

    7. Objectives, learning outcomes and obtained knowledge The scope of the subject is to get the students acquainted with the development of the packaged intelligent devices operating environment, the design software, the modern simulation tools. Deals with the design, testing, simulation steps and gives practical knowledge on their industrial applications. Introduce the theoretical background of the simulations and physical phenomenon.
    8. Synopsis
    Syllabus of the lectures
    1. The phenomena of circuit environment, borders of the circuit environment, the design steps and implementation issues of SiP, SoP, MCM, 3D stacked ICs devices, TSV.
    2. Modern packaging solutions. Fann-ot, WLP, intermediate enclosures with buried silicon layers (EMIBB). Relationship of IC design and enclosure from the design perspective.
    3. Investigation of parasitic effects of packaging on the basis of Radio Frequency, thermal and other physical influences: IBIS model, Delphi model, 2R model
    4. Development of circuit environment influenced by thermal effects. Active and passive cooling methods, build-up and characterization of microscale cooling devices.
    5. Thermal analysis of equipments working in harsh environment (rack drawers, IoT devices in harsh environment, etc.)
    6. Thermal transient testing methodology, multi-domain characterization of LED devices, characterization of thermal interface materials (TIM)
    7. Introduction of a whole process development flow: the basic steps of the development, test methods, management issues. Reliability investigations, the effects of the ambient to the operation of the circuit.
    8. Design flow of electrical equipment from the specification to the realization. Top-down and bottom-up methodology applied in the development flow of the circuit environment (PCW, connections, enclosures, etc.)
    9. Specification and documentation issues of the circuit environment.
    10. Introduction to signal integrity: plane capacitance, losses, delays, skin effect and proximity effect, wave impedance and passive devices in real parasitic elements.
    11. Reflections, terminations of transmission lines: under and overdriven lines, series and parallel R, RC terminations, Thevenin termination, junction
    12. Case study: pre-layout signal integrity simulation
    13. Cross-talk, differential and common mode signals and impedances, signal propagation
    14. Thermal management with industrial CAD tools (Mentor Graphics© FloTHERM)

    Syllabus of the laboratory practises:
    1. Getting acquainted to a PCW design environment and its build-up
    2. Schematic capture
    3. The usage and the settings of constraint editor system
    4. Design of the layout
    5. Thermal simulation
    6. pre- and post-layout signal integrity simulations
    7. Thermal analysis of packages (Mentor Graphics© FloTHERM® PACK).

    9. Method of instruction 2 hours/week lectures and 1 hour/week (computer) laboratory practices including demonstration with practical examples and case studies.
    10. Assessment

    a.         During the term: one mid-term test in the 8th week of the semester

    Requirement for granting the signature: >= 2 (satisfactory).

    The signature is valid for the next semester, too.

    b.         In the exam period:

    Way of examination: written and oral

    c.         Exam before the examination period:

    Possible if the midterm grade >= 4

    11. Recaps

    One mid-term test.

    If a student fails to turn up at mid-term test, it can be repeated during the term.

    Only one laboratory practice can be repeated during the repeat period.

    12. Consultations By appointment with the instructors.
    13. References, textbooks and resources -        Clyde F. Coombs: „Printed Circuits Handbook, 6th edition”, McGraw-Hill, USA, 2008
    -        Eric Bogatin: „Signal Integrity – Simplified”, Prentice Hall, USA, 2004
    -        Stephen H. Hall, Garrett W. Hall, James A. McCall: „High- Speed Digital System – A Handbook of Interconnect Theory and Design Practice”, John Wiley & Sons, Inc. USA, 2000
    -        Horward Johnson, Martin Graham: „High-Speed Digital Design – A Handbook of Black Magic, Prentice Hall”, New Jersey, USA, 1993
    -        Mentor Graphics - Printed Circuit Board Design Course Laboratory Instruction:  „Pre-Layout Analysis with HyperLynx”, Politechnika ¦l±ska w Gliwicach, Instytut Elektroniki, Zakład Podstaw Elektroniki
    -        Mentor Graphics – HyperLynx Design kits

    14. Required learning hours and assignment



    Preparation for lectures


    Preparation for practices


    Preparation for laboratories


    Preparation for midterms




    Literature review


    Preparation for exam




    15. Syllabus prepared by



    Department, Institute:

    Dr. György Bognár

    Associate Professor

    Department of Electron Devices

    Dr. Péter Gábor Szabó

    Assistant Professor

    Department of Electron Devices

    Zoltán Szűcs


    Department of Electron Devices

    Ericsson Hungary Ltd.

    Dr. Ferenc Farkas

    h.c. Associate Professor

    Signal integrity engineer, project manager


    Department of Electron Devices,

    Ericsson Hungary Ltd.