Design of Microelectronics System

A tantárgy neve magyarul / Name of the subject in Hungarian: Mikroelektronikai rendszerek tervezése

Last updated: 2015. február 11.

Budapest University of Technology and Economics
Faculty of Electrical Engineering and Informatics

Branch of Electrical Engineering MSc
Microelectronics and Electronics Technology main specialization

Course ID Semester Assessment Credit Tantárgyfélév
VIEEMA02 2 2/1/0/v 4  
3. Course coordinator and department Dr. Bognár György, Elektronikus Eszközök Tanszéke
4. Instructors

Name:

Affiliation:

Department, Institute:

Dr. György Bognár

Associate Professor

Department of Electron Devices

Dr. Sándor László Ress

Associate Professor

Department of Electron Devices

Dr. Péter Gábor Szabó

Assistant Professor

Department of Electron Devices

5. Required knowledge Electronics
6. Pre-requisites
Kötelező:
NEM ( TárgyEredmény( "BMEVIEEM164" , "jegy" , _ ) >= 2
VAGY
TárgyEredmény( "BMEVIEEM162" , "jegy" , _ ) >= 2
VAGY
TárgyEredmény("BMEVIVIEEM164", "FELVETEL", AktualisFelev()) > 0
VAGY
TárgyEredmény("BMEVIEEM162", "FELVETEL", AktualisFelev()) > 0)

A fenti forma a Neptun sajátja, ezen technikai okokból nem változtattunk.

A kötelező előtanulmányi rendek grafikus formában itt láthatók.

Ajánlott:
-
7. Objectives, learning outcomes and obtained knowledge In the frame of the Design of Microelectronics System course the special methodologies and tools during the design of analogue, mixed-signal integrated circuits and Micro Electro Mechanical Systems (MEMS) will be introduced. The aim of the course to give knowledge and practical skills about modern integrated circuits and MEMS structures, System-on-Chip (SoC) and System-in-Package (SiP) devices, design methodology of integrated circuits applied in cyberphysical-systems, computer aided IC design (CAD) tools, the principal components, the complete design and verification flow and the future trends. The 2nd order effects (e.g.: thermal influences) will be discussed also.
8. Synopsis Syllabus of lectures:
  1. Introduction into the mixed-signal, very large scale integrated systems, development trends, ITRS roadmap, Smart System devices.
  2. Build-up and design methodology of System-on-chip (SoC) VLSI systems, detailed SoC design flow
  3. More than Moore integration, 3D IC technology, stacked die structures, System-on-Chip, System-in-Package, design methodology and technology of 3D IC integration
  4. The effect of scale-down, physical and technology limits, new solutions applied in modern CMOS technologies (gate engineering, high K, low K, strained silicon, multi VT technique, electro-migration, tri-gate&FinFET transistors) from the point of view of the designer
  5. Design methodology of low-power systems, the possibility reduction of the power consumption, typical low-power circuits and techniques. Typical feature of high and radio frequency integrated circuits’ structures. The design methodology of RF circuits, problems of modelling. Realization of inductivity on the semiconductor surface.
  6. Case study – introduction and analysis of typical LSI circuit from the field of telecommunications: architecture of typical transceiver circuits and frequency dividers. Design methodology of pulse swallower and phase changing frequency dividers. Packaging of RF circuits.
  7. Design and analysis of typical analogue integrated circuits applied in telecommunications, sensor read-out circuitries and signal processing: amplifiers, A/D and D/A converters, etc.)
  8. Design and analysis of typical analogue circuits: differential pair, current mirror, OTA, opamp
  9. Design methodology and practical skills of analogue / mixed-signal layout.
  10. Physical effect taken into account during design (e.g.: thermal, high frequency, etc.). Thermal aware design: thermal influences in the layout design.
  11. Electro-thermal, logi-thermal and cell-thermal simulation tools, comparison, operation principles, case studies
  12. The elements of a modern IC design framework on a defined IC process technology. The phenomena of Process Design Kit (PDK)
  13. Extension of classical IC PDK to MEMS design. The applied CAD/CAM tools in the MEMS design flow. MEMS Design strategies. Introduction of application specific design methodologies. Case studies.
  14. Coupled physical modelling issues, analysis of multidomain (e.g.: the circuit models for each analogue systems, reduced order model and its relationship with the system-level behavioral descriptions, multi-physics simulations), investigation of energy conversion processes.
  15. Computational modelling and simulation of MES structures, finite element method, reduced order model / network model. Overview of simulation tools. Introducing the design and simulation tools of MEMS
Syllabus of laboratory practices:
  1. Getting acquainted with the IC design framework system, introduction to the design flow, case study. Getting the specification
  2. Design and simulation of the schematic of the selected circuit (DC, AC, transient)
  3. Investigation of the circuit operation in addition to the process scattering and ambient temperature changes. Redesign of the circuit.
  4. Design steps and flow of the MEMS device. The physical design of a selected MEMS structure
  5. Simulation of the operation of the MEMS structure by FEM simulation tools.
  6. Co-design and co-simulation possibilities and method of System on chip devices.

9. Method of instruction 2 hours/week lectures and 1 hour/week (computer) laboratory practices including demonstration with practical examples and case studies.
10. Assessment

a.         During the term: one mid-term test

Requirement for granting the signature: >= 2 (satisfactory).

The signature is valid for the next semester, too.

b.         In the exam period:

Way of examination: written and oral

c.         Exam before the examination period:

Possible if the midterm grade >= 4
11. Recaps

On mid-term test

If a student fails to turn up at mid-term test, it can be repeated during the term.

Failed mid-term test can be repeated in the repeat period only once.

12. Consultations By appointment with the instructors.
13. References, textbooks and resources -        Wai-Kai Chen , ”The VLSI handbook”, CRC Press LLC, 2000. ISBN 0-8493-8593-8

-        Mohamed Gad-el-Hak, ”MEMS Design and Fabrication”, CRC Press LLC, 2006. ISBN 0-8493-9138-5

-        Stephen D. Senturia, „Microsystem design” Kluwer Academic Publishers. 2002. ISBN 0-7923-7246-8

-        Journal papers:

o   IEEE Solid State Technology, IEEE VLSI Circuits (http://ieeexplore.ieee.org)

o   European Semiconductors

14. Required learning hours and assignment
Classes42
Preparation for classes18
Preparation for test15
Homework 
Learning the prescribed matters 
Preparation for exam45
 Sum 120
15. Syllabus prepared by

 

Name:

Affiliation:

Department, Institute:

Dr. György Bognár

Associate Professor

Department of Electron Devices

Dr. András Poppe

Associate Professor

Department of Electron Devices

Dr. Sándor László Ress

Associate Professor

Department of Electron Devices

Dr. Péter Gábor Szabó

Assistant Professor

Department of Electron Devices