Budapest University of Technology and Economics, Faculty of Electrical Engineering and Informatics

A kötelező előtanulmányi rend az adott szak honlapján és képzési programjában található.

1. Introduction into the mixed-signal, very large scale integrated systems, development trends, ITRS roadmap, Smart System devices.
2. Build-up and design methodology of System-on-chip (SoC) VLSI systems, detailed SoC design flow
3. More than Moore integration, 3D IC technology, stacked die structures, System-on-Chip, System-in-Package, design methodology and technology of 3D IC integration
4. The effect of scale-down, physical and technology limits, new solutions applied in modern CMOS technologies (gate engineering, high K, low K, strained silicon, multi VT technique, electro-migration, tri-gate&FinFET transistors) from the point of view of the designer
5. Design methodology of low-power systems, the possibility reduction of the power consumption, typical low-power circuits and techniques. Typical feature of high and radio frequency integrated circuits’ structures. The design methodology of RF circuits, problems of modelling. Realization of inductivity on the semiconductor surface.
6. Case study – introduction and analysis of typical LSI circuit from the field of telecommunications: architecture of typical transceiver circuits and frequency dividers. Design methodology of pulse swallower and phase changing frequency dividers. Packaging of RF circuits.
7. Design and analysis of typical analogue integrated circuits applied in telecommunications, sensor read-out circuitries and signal processing: amplifiers, A/D and D/A converters, etc.)
8. Design and analysis of typical analogue circuits: differential pair, current mirror, OTA, opamp
9. Design methodology and practical skills of analogue / mixed-signal layout.
10. Physical effect taken into account during design (e.g.: thermal, high frequency, etc.). Thermal aware design: thermal influences in the layout design.
11. Electro-thermal, logi-thermal and cell-thermal simulation tools, comparison, operation principles, case studies
12. The elements of a modern IC design framework on a defined IC process technology. The phenomena of Process Design Kit (PDK)
13. Extension of classical IC PDK to MEMS design. The applied CAD/CAM tools in the MEMS design flow. MEMS Design strategies. Introduction of application specific design methodologies. Case studies.
14. Coupled physical modelling issues, analysis of multidomain (e.g.: the circuit models for each analogue systems, reduced order model and its relationship with the system-level behavioral descriptions, multi-physics simulations), investigation of energy conversion processes.
15. Computational modelling and simulation of MES structures, finite element method, reduced order model / network model. Overview of simulation tools. Introducing the design and simulation tools of MEMS

1. Getting acquainted with the IC design framework system, introduction to the design flow, case study. Getting the specification
2. Design and simulation of the schematic of the selected circuit (DC, AC, transient)
3. Investigation of the circuit operation in addition to the process scattering and ambient temperature changes. Redesign of the circuit.
4. Design steps and flow of the MEMS device. The physical design of a selected MEMS structure
5. Simulation of the operation of the MEMS structure by FEM simulation tools.
6. Co-design and co-simulation possibilities and method of System on chip devices.

a.         During the term: one mid-term test

Requirement for granting the signature: >= 2 (satisfactory).

The signature is valid for the next semester, too.

b.         In the exam period:

Way of examination: written and oral

c.         Exam before the examination period:

On mid-term test

If a student fails to turn up at mid-term test, it can be repeated during the term.

Failed mid-term test can be repeated in the repeat period only once.

-        Mohamed Gad-el-Hak, ”MEMS Design and Fabrication”, CRC Press LLC, 2006. ISBN 0-8493-9138-5

-        Stephen D. Senturia, „Microsystem design” Kluwer Academic Publishers. 2002. ISBN 0-7923-7246-8

-        Journal papers:

o   IEEE Solid State Technology, IEEE VLSI Circuits (http://ieeexplore.ieee.org)

o   European Semiconductors