Budapest University of Technology and Economics, Faculty of Electrical Engineering and Informatics

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    Design of Microelectronics System

    A tantárgy neve magyarul / Name of the subject in Hungarian: Mikroelektronikai rendszerek tervezése

    Last updated: 2015. február 11.

    Budapest University of Technology and Economics
    Faculty of Electrical Engineering and Informatics

    Branch of Electrical Engineering MSc
    Microelectronics and Electronics Technology main specialization

    Course ID Semester Assessment Credit Tantárgyfélév
    VIEEMA02 2 2/1/0/v 4  
    3. Course coordinator and department Dr. Bognár György, Elektronikus Eszközök Tanszéke
    4. Instructors

    Name:

    Affiliation:

    Department, Institute:

    Dr. György Bognár

    Associate Professor

    Department of Electron Devices

    Dr. Sándor László Ress

    Associate Professor

    Department of Electron Devices

    Dr. Péter Gábor Szabó

    Assistant Professor

    Department of Electron Devices

    5. Required knowledge Electronics
    6. Pre-requisites
    Kötelező:
    NEM ( TárgyEredmény( "BMEVIEEM164" , "jegy" , _ ) >= 2
    VAGY
    TárgyEredmény( "BMEVIEEM162" , "jegy" , _ ) >= 2
    VAGY
    TárgyEredmény("BMEVIVIEEM164", "FELVETEL", AktualisFelev()) > 0
    VAGY
    TárgyEredmény("BMEVIEEM162", "FELVETEL", AktualisFelev()) > 0)

    A fenti forma a Neptun sajátja, ezen technikai okokból nem változtattunk.

    A kötelező előtanulmányi rendek grafikus formában itt láthatók.

    Ajánlott:
    -
    7. Objectives, learning outcomes and obtained knowledge In the frame of the Design of Microelectronics System course the special methodologies and tools during the design of analogue, mixed-signal integrated circuits and Micro Electro Mechanical Systems (MEMS) will be introduced. The aim of the course to give knowledge and practical skills about modern integrated circuits and MEMS structures, System-on-Chip (SoC) and System-in-Package (SiP) devices, design methodology of integrated circuits applied in cyberphysical-systems, computer aided IC design (CAD) tools, the principal components, the complete design and verification flow and the future trends. The 2nd order effects (e.g.: thermal influences) will be discussed also.
    8. Synopsis Syllabus of lectures:
    1. Introduction into the mixed-signal, very large scale integrated systems, development trends, ITRS roadmap, Smart System devices.
    2. Build-up and design methodology of System-on-chip (SoC) VLSI systems, detailed SoC design flow
    3. More than Moore integration, 3D IC technology, stacked die structures, System-on-Chip, System-in-Package, design methodology and technology of 3D IC integration
    4. The effect of scale-down, physical and technology limits, new solutions applied in modern CMOS technologies (gate engineering, high K, low K, strained silicon, multi VT technique, electro-migration, tri-gate&FinFET transistors) from the point of view of the designer
    5. Design methodology of low-power systems, the possibility reduction of the power consumption, typical low-power circuits and techniques. Typical feature of high and radio frequency integrated circuits’ structures. The design methodology of RF circuits, problems of modelling. Realization of inductivity on the semiconductor surface.
    6. Case study – introduction and analysis of typical LSI circuit from the field of telecommunications: architecture of typical transceiver circuits and frequency dividers. Design methodology of pulse swallower and phase changing frequency dividers. Packaging of RF circuits.
    7. Design and analysis of typical analogue integrated circuits applied in telecommunications, sensor read-out circuitries and signal processing: amplifiers, A/D and D/A converters, etc.)
    8. Design and analysis of typical analogue circuits: differential pair, current mirror, OTA, opamp
    9. Design methodology and practical skills of analogue / mixed-signal layout.
    10. Physical effect taken into account during design (e.g.: thermal, high frequency, etc.). Thermal aware design: thermal influences in the layout design.
    11. Electro-thermal, logi-thermal and cell-thermal simulation tools, comparison, operation principles, case studies
    12. The elements of a modern IC design framework on a defined IC process technology. The phenomena of Process Design Kit (PDK)
    13. Extension of classical IC PDK to MEMS design. The applied CAD/CAM tools in the MEMS design flow. MEMS Design strategies. Introduction of application specific design methodologies. Case studies.
    14. Coupled physical modelling issues, analysis of multidomain (e.g.: the circuit models for each analogue systems, reduced order model and its relationship with the system-level behavioral descriptions, multi-physics simulations), investigation of energy conversion processes.
    15. Computational modelling and simulation of MES structures, finite element method, reduced order model / network model. Overview of simulation tools. Introducing the design and simulation tools of MEMS
    Syllabus of laboratory practices:
    1. Getting acquainted with the IC design framework system, introduction to the design flow, case study. Getting the specification
    2. Design and simulation of the schematic of the selected circuit (DC, AC, transient)
    3. Investigation of the circuit operation in addition to the process scattering and ambient temperature changes. Redesign of the circuit.
    4. Design steps and flow of the MEMS device. The physical design of a selected MEMS structure
    5. Simulation of the operation of the MEMS structure by FEM simulation tools.
    6. Co-design and co-simulation possibilities and method of System on chip devices.

    9. Method of instruction 2 hours/week lectures and 1 hour/week (computer) laboratory practices including demonstration with practical examples and case studies.
    10. Assessment

    a.         During the term: one mid-term test

    Requirement for granting the signature: >= 2 (satisfactory).

    The signature is valid for the next semester, too.

    b.         In the exam period:

    Way of examination: written and oral

    c.         Exam before the examination period:

    Possible if the midterm grade >= 4
    11. Recaps

    On mid-term test

    If a student fails to turn up at mid-term test, it can be repeated during the term.

    Failed mid-term test can be repeated in the repeat period only once.

    12. Consultations By appointment with the instructors.
    13. References, textbooks and resources -        Wai-Kai Chen , ”The VLSI handbook”, CRC Press LLC, 2000. ISBN 0-8493-8593-8

    -        Mohamed Gad-el-Hak, ”MEMS Design and Fabrication”, CRC Press LLC, 2006. ISBN 0-8493-9138-5

    -        Stephen D. Senturia, „Microsystem design” Kluwer Academic Publishers. 2002. ISBN 0-7923-7246-8

    -        Journal papers:

    o   IEEE Solid State Technology, IEEE VLSI Circuits (http://ieeexplore.ieee.org)

    o   European Semiconductors

    14. Required learning hours and assignment
    Classes42
    Preparation for classes18
    Preparation for test15
    Homework 
    Learning the prescribed matters 
    Preparation for exam45
     Sum 120
    15. Syllabus prepared by

     

    Name:

    Affiliation:

    Department, Institute:

    Dr. György Bognár

    Associate Professor

    Department of Electron Devices

    Dr. András Poppe

    Associate Professor

    Department of Electron Devices

    Dr. Sándor László Ress

    Associate Professor

    Department of Electron Devices

    Dr. Péter Gábor Szabó

    Assistant Professor

    Department of Electron Devices