Budapest University of Technology and Economics, Faculty of Electrical Engineering and Informatics

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    Microelectronics and Microsystems

    A tantárgy neve magyarul / Name of the subject in Hungarian: Mikroelektronika és mikrorendszerek

    Last updated: 2016. szeptember 27.

    Budapest University of Technology and Economics
    Faculty of Electrical Engineering and Informatics

    Branch of Electrical Engineering
    PhD

    Course ID Semester Assessment Credit Tantárgyfélév
    VIEED071 PhD 4/0/0/v 5 1/1
    3. Course coordinator and department Dr. Szabó Péter Gábor, Elektronikus Eszközök Tanszéke
    4. Instructors

    Name:

    Assignment:

    Department:

    Dr. Péter Gábor Szabó

    senior lecturer

    BME EET

    Dr. János Mizsei

    professor

    BME EET

    Dr. Imre Zólomy

    professor emeritus

    BME EET

    Dr. Márta Rencz

    professor

    BME EET

    5. Required knowledge VLSI circuits, microelectronics
    7. Objectives, learning outcomes and obtained knowledge

    The subject introduces students to advanced microelectronics solutions, the latest results and typical structures of integrated microsystems (MEMS, MOEMS), their operating principle. It discusses the issues of construction and testing.

    8. Synopsis

    Implementation of transistors, resistors, capacitors, etc with bipolar and MOS technologies. Their parameters, electrical qualities depending on the technology used. Technology and device construction contexts. Device modeling questions. New issues raised by the implementation of submicron devices. Electromigration.


    The definition of micro-systems. the impact of scale down to the characteristics of the (micro) systems. Deriving and the role in micro-technology of the characteristic distances and times. Advanced technological processes for the realization of micro(mechanical) systems to: to achieve great height / width ratio. Surface and bulk processing techniques: layer deposition and machining, isotropic and anisotropic etching techniques, dry etching (plasma etching), wet chemical etching processes, electrochemical processes, etching selectivity. Wafer bonding. Sacrificial layer technique. IC production compatible methods. The LIGA process. Standard MEMS Technologies: MUMPS, SUMMiT V, TDSI MIDIS, AMS Bulk Micromachining etc.

    Basics of mechanics of materials: tension, strain, Hooke's law. shear stress. Tensor theory of mechanics of materials. The stress tensor and strain tensor. Tensorial elastic modulus. The case of silicon. The bent rod. The second order torque. Tthe dependence of the radius of curvature from torque. The screw rod. The deformation of the loaded console. The calculation of the spring constant. The both ends clamped spring permissiveness. Mechanical resonance frequency calculation of a console (bending mode). Concentrated parametric approach. Differential equation of the distributed parameter problem.

    Mechanical sensors: accelerometer unit. Construction, operation. Sensitivity calculation. Sensing methods that can be used in accelerometers. Pressure micro-sensors (absolute and relative), membrane technologies.

    The electro-thermal transport equations. Seebeck, Peltier and Thomson effects. Temperature sensors: termoresistor, pn diode sensor, bipolar transistor sensor. The PTAT principle. MOS transistor sensor. Temperature gradient sensing by thermocouple.

    Thermal radiation-based infrared detector. The sensitivity calculation (equivalent input noise level). Thermal authoritarian rms meter. Flow rate and direction sensing by thermal principle.

    Other micro-sensors: electric, magnetic, radiation and chemical sensors.

    Actuators: light modulation by rotating micromirror. The calculation of the torque of electrostatic movement. Torque-rotation diagrams, possible stable states. Electrostatic micro-motors and other drive mechanisms.

    Fundamentals of fluid mechanics, microfluidics, Lab-on-Chip systems. Pneumatic micro systems: air reinforcing beam writing. Micro cooling systems.

    Typical measurement methods that are used for measuring electrical, optical, micro-mechanical properties of the used materials and structures (electron microscopy, micro-analysis, based on X-ray and micro-mechanical scanning method, infrared thermography, thermal transient testing, photonic devices (LEDs) combined optical, electrical, thermal testing)
     

    Design, implementation and testing issues of complex micro systems with electrical, mechanical and optical elements. The automated design tools: physical simulators. Modelling (ROM, compact modeling, distributed and concentrated models); high-level language description of attached multi-domain systems.

    9. Method of instruction Lecture and seminarium.
    10. Assessment


    a. During the study period: condition for the signature is min. sufficient level of a homework: a microelectronic or MEMS-themed, English-language journal article processing and seminar-type presentation.

    b. During the examination period: exam of written and oral parts.


    11. Recaps Homework can be replaced in the replacement period.
    12. Consultations After personal arrangements with the lecturers.
    13. References, textbooks and resources

    Mikroelektronika és Elektronikai Technológia, Szerk. Dr. Mojzes I. Műszaki Könyvkiadó, 1995

    A. S. Sedra, K. C. Smith: Microelectronic circuits, Oxford University Press, 1998

    CMOS Analog Circuit Design, P.E.Allen, D.R. Holberg, Oxford University Press, 1987

    Microsensors, J.W. Gardner, John Wiley & Sons, 1994

    Mikromechanik, A. Heuberger (Hrsg), Springer Verlag, 1991

    IEEE/ASME Journal of Microelectromechanical Systems folyóirat egyes számai

    MSTnews International Newsletter on Microsystems and MEMS folyóirat egyes számai

    Clemens J. M. Lasance András Poppe: Thermal Management for LED Applications, Springer 2014

    Vijay K. Varadan, K. J. Vinoy, S. Gopalakrishnan: Smart Material Systems and MEMS:

    Design and Development Methodologies, John Wiley & Sons, 2006

    Volker Kempe: Inertial MEMS Principles and Practice, Cambridge University Press, 2011

    Stephen D. Senturia: Microsystem Design, Kluwer Academics Publisher 2002

    Baltes, Brand, Fedder Hierold, Korvink, Tabata: Advanced Micro & Nanosystems Volume 2 CMOS – MEMS, Wiley-VCH, 2005

    Maluf, Williams: An Introduction to Microelectromechanical Systems Engineering, Artech House, Inc., 2004

    Lau, Lee, Premachandran, Aibin: Advanced MEMS Packaging, The McGraw-Hill Companies, 2010

    T. Bechtold E.B. Rudnyi J.G. Korvink: Fast Simulation of Electro-Thermal MEMS, Springer, 2006

    14. Required learning hours and assignment

    Contact classes

    60

    Mid semester prep for classes

    15

    Prep for tests

     

    Homework

    30

    Designated written curriculum learning

    15

    ..

     

    Prep for exam

    30

    All

    150

    15. Syllabus prepared by

    Name:

    Assignment:

    Department.:

    Dr. Székely Vladimír

    egyetemi tanár

    BME EET

    Dr. Kovács Ferenc

    egyetemi tanár

    BME EET

    Dr. Mizsei János

    egyetemi tanár

    BME EET

    Kerecsenné Dr. Rencz Márta
    egyetemi tanár
    BME EET