Microelectronics

A tantárgy neve magyarul / Name of the subject in Hungarian: Mikroelektronika

Last updated: 2012. március 27.

Budapest University of Technology and Economics
Faculty of Electrical Engineering and Informatics
Electrical Engineering B.Sc.
Course ID Semester Assessment Credit Tantárgyfélév
VIEEA306 5 3/0/1/f 5  
3. Course coordinator and department Dr. Poppe András, Elektronikus Eszközök Tanszéke
4. Instructors
Name:

 

Position:

 

Department/Institute:

 

András Poppe, PhD

 

(lectures)

 

assoc. prof.

 

Department of Electron Devices

 

György Bognár, PhD

 

(lab sessions)

 

assoc. prof.

 

Department of Electron Devices

 

5. Required knowledge Electronics 1-2, Digital technique 1, Physics C2, Electronics Technology, Materials science

 

6. Pre-requisites
Kötelező:
(TárgyEredmény( "BMEVIHIA205" , "aláírás" , _ ) = -1
VAGY
TárgyEredmény( "BMEVIHI3020" , "aláírás" , _ ) = -1
VAGY
TárgyEredmény( ahol a TárgyKód = "BMEVIDHKV05", ahol a Típus = "JEGY", ahol a Ciklus = tetszőleges, ahol a KépzésKód = tetszőleges) >=2
VAGY
KépzésLétezik( ahol a KépzésKód = "5N-07")
VAGY
Szakirány( ahol a SzakirányKód = "KIEGVBSC", ahol a Ciklus = "2007/08/1") )

ÉS NEM ( TárgyEredmény( "BMEVIEEAB00" , "jegy" , _ ) >= 2
VAGY
TárgyEredmény("BMEVIEEAB00", "FELVETEL", AktualisFelev()) > 0)

ÉS Training.Code=("5N-A7")

A fenti forma a Neptun sajátja, ezen technikai okokból nem változtattunk.

A kötelező előtanulmányi rendek grafikus formában itt láthatók.

Ajánlott:
Neptun-code  Title

 

BMEVIHIA205        Electronics 1      completed with setisfactory result

 

or

 

BMEVIHI3020         Electronics 2      completed with setisfactory result

 

7. Objectives, learning outcomes and obtained knowledge Electronics and informatics is based on integrated circuits. Every electrical engineer has to be aware of the basics of the construction and operation of ICs.  Knowledge about the elementary procedures of design of integrated circuits is also a must. We also aim to show the students the link between system level circuit design and the realization of the circuits.

 

The objective of our subject is to provide knowledge in the above mentioned fields. Special epmphasis is put on related practical skills. This is achieved by solving different problems by means of numerical calculations, analysing cases studies. Cumpeter laboratory excercises, during which different steps of IC design flowas are introduced, also support this

 

An essential target of the subject is to highlight the relationship between the abstract electronic function and the actual physical operation. Therefore the physical operation of components of ICs (diodes, transistors) is discussed in details. Physics and operation of MEMS and MOEMS devises are also discussed. Finally the subject provides an outlook to development trends – photonics and nanoelectronics.

 

The subject Microelectronics is the last element of the string of subjects, starting with Electronics 1 and 2. and spanning over three semesters.
8. Synopsis Course material available at www.eet.bme.hu/~poppe/miel Further resources available in the educational portal of the Department (edu.eet.bme.hu)

 

Introduction, IC manufacturing processes, basic terms of art. Development trends (Moore’s law). Basic steps of microelectronics technologies: layer deposition, patterning, doping.

 

The manufacturing process at the department’s clean-room facility. Basics of semiconductor physics: band structure, generation and recombination, carrier concentrations in intrinsic and doped semiconductor materials. Mass-action law. Currents in semiconductors (drift, diffusion). Einstein’s relationship.

 

Lab#1 – visit to the clean-room facility, investigating IC-s through optical microscope  

 

The pn junction – how it works? Basic poroperties. Real diodes and the ’internal junction’. Diode characteristics (farward, reverse), secondary effects (series resistance, generation current, recombination current, brakedown phenomena). DC operating point. DC model of diodes.

 

Dynamic properties of diodes. Temperaure dependence.

 

Lab#2 – thermal simulation of electronic systems

 

The bipolar transistor (structure, operation). Amplification. Currents in a BJT.

 

The built-in electric field in a BJT. Injection and transport efficiency. Different modes of operation of a BJT, Ebers-Moll model

 

Bipoláris tranzisztor beépített tér számítása, Injektálási és transzport hatásfok, A tranzisztor üzemmódjai, Ebers-Moll modell

 

Lab#3 – Circuit simulation with a SPICE-like program

 

Characteristics of an ideal BJT (in common base and common emitter setups). Characteristics of real BJT-s, secondary effects (parasitic CB diode, series resistances, Early-effect, base-width modulation.

 

Set of IC components available in a bipolar process (resistors with base diffusion, with base and emitter diffusion, PNP transistors, thin-film capacitor). Layout of a classical OpAmp.

 

Lab#4 – Verilog simulation

 

Thermal phenomena in case of analog IC-s. Thermal impedances, thermal feedback. How layout affects the circuit operation through thermal effects. Thermally optimized layout of a bipolar OpAmp.

 

Small signal models of BJT-s, high frequency operation.

 

Field effect transistors. Operation and chacateristics of JFETs. The pinch-off voltage.

 

Operation of MOSFETs, the phiscal basics (the MOS capacitance, energy, charge and potential distributions at the semiconductor-dielectric interface, the threshold voltage). The device characteristics, some secondary effects (short/narrow channel effects, temperature dependence, subthreshold currents)

 

Lab#5 - Digital IC design and FPGA design (Verilog synthesis)

 

MOS inverters – major properties and characteristics

 

MOS and CMOS circuits: design and construction. Power consumption of CMOS digital circuits. Steps of the most basic self-aligned poli-Si gate MOS process. Layout and cross section of a CMOS inverter.

 

Integrated circuits: major properties; manufacturing and design; cost factors.

 

Overview of IC design tools. Design flows. Design rules. Standard cell design. MPW manufacturing. Design of digital circuits for FPGA realization. SoC. HDLs (VHDL, Verilog, System-C). Hardware-software co-design.

 

Issues of IC packaging. Thermal properties of IC packages. Testing of ICs. Scan designs. The boundary scan.

 

Typical VLSI circuits: memories, AD/DA converters.

 

MEMS devices and issues of MEMS design.

 

Special semiconductors such as LEDs, CCD arrays. Examples for organic semiconductor devices: OLEDs.

 

Last lab  – recap option for one lab session

 

9. Method of instruction 3 hours/week lectures and 2 hour/2weeks laboratory exercise.
10. Assessment a.     In the class period: two midterm tests, small tests at every laboratory exercise

 

          Requirement for the signature: final mark >= 2 (setisfactory).

 

        Final mark is based on the lumped results of the two mid-term tests (80% weight) and   perrformance during the lab sessions (20% weight).

 

        Threshold for setisfactory results: minimum 40% of the maximal score.

 

b.     In the examination period: n.a.

 

c.      Exam before the examination period: n.a.

 

11. Recaps One out of the two midterm tests, one laboratory excercise

 

12. Consultations By appointment.

 

13. References, textbooks and resources handouts
14. Required learning hours and assignment
Classes56
Preparation for classes20
Preparation for test20
Homework
Learning of prescribed matters10
Preparation for lab sessions14
Összesen120
15. Syllabus prepared by
Name:

 

Position:

 

Department/Institute:

 

Vladimír Székely, DSci

 

professor

 

Department of Electron Devices

 

András Poppe, PhD

 

assoc. prof.

 

Department of Electron Devices